Mirae nozzle
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The SMT Mirae E-Type 3225 Nozzle (Part No. 21003-63000-005) is designed for precise handling of 3225 chip components. Built for use with Mirae high-speed placement machines, this nozzle ensures high accuracy, consistent suction, and long service life in demanding SMT production environments.
The SMT Mirae D-Type 3216 Nozzle (Part No. 21003-62000-105) is tailored for precise and efficient placement of 3216-size chip components. Designed for compatibility with Mirae high-speed mounters, it ensures stable vacuum performance and long-lasting reliability.
The SMT Mirae C-Type 2125 Nozzle (Part No. 21003-63000-005) is designed for accurate placement of 2125-size chip components. Compatible with Mirae high-speed machines, this nozzle provides reliable performance, high precision, and long service life.
The SMT Mirae B-Type 1608 Nozzle (Part No. 21003-67000-003) is specifically engineered for accurate placement of 1608 chip components. Designed for Mirae high-speed mounters, it offers stable performance, high durability, and reliable component handling.
The SMT Mirae A-Type 1005 Nozzle (Part No. 21003-61000-104) is designed for high-accuracy placement of small components in high-speed SMT production lines. Compatible with Mirae placement machines, it ensures smooth handling of 1005 chip components with outstanding precision and durability.
The Mirae Future A–E nozzle family delivers a complete 0201–1206 component solution. Each unit combines a monolithic aerospace-ceramic tip with a hardened stainless-steel body, proven on Foxconn and BYD lines for ≥800 k cycles at ≥99 % placement yield. Install once and run your Mirae high-speed mounter 24×7 with zero rejects, zero wear, and zero downtime.
The Mirae Future D-3216 nozzle is built for high-speed placement of 3216 (1206) and smaller components. Its aerospace-grade ceramic tip bonded to hardened stainless steel has been proven on Foxconn and BYD lines for 800 k cycles without wear or rejects. Swap in one nozzle to push placement yield above 99 % and drive downtime to near zero—the smart upgrade for cost-efficient, high-end SMT production.
The Mirae XP400LP D# is a factory-original nozzle purpose-built for Mirae high-speed pick-and-place systems handling 0.3 mm–0.5 mm dies and 0402–0603 devices. Aerospace-grade ceramic bonded to reinforced stainless steel delivers verified 800 k-cycle durability on BYD and Foxconn lines with zero rejects. Swap in one nozzle to boost placement yield above 99 % and cut downtime to near zero—the smart upgrade for cost-efficient, high-end SMT lines.
The Mirae XP400LP C# nozzle is engineered for Mirae high-speed pick-and-place machines. Built with aerospace-grade ceramic and reinforced stainless steel, it securely handles 0.15 mm ultra-thin dies. A patented vacuum-flow channel cuts component drift to 0.01 mm and supports 0201–0402 micro-components. Proven on Foxconn and BYD lines, lifespan exceeds 800 k cycles. Upgrade your SMT line to zero rejects, zero wear, zero downtime.
Optimize MIRAE XP400LP performance with nozzle set A/B/C/D/E:
A/B型: Micro tips (0.3-1.2mm) for 0201/IC chips.
C/D/E型: Large nozzles (1.5-3.5mm) for connectors/BGAs.
RoHS-compliant, pre-calibrated for MX400LP/MC series. Includes 12-month warranty and 24/7 technical support.
A/B型: Micro tips (0.3-1.2mm) for 0201/IC chips.
C/D/E型: Large nozzles (1.5-3.5mm) for connectors/BGAs.
RoHS-compliant, pre-calibrated for MX400LP/MC series. Includes 12-month warranty and 24/7 technical support.
MIRAE nozzles are mainly used for SMD surface mounting equipment, suitable for various placement machines, used to pick and place electronic components onto PCBs (uit boards)
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