The Mirae XP400LP C# nozzle is the factory-original suction solution for Mirae high-speed SMT placement systems. It combines a sub-micron ceramic tip with a hardened-stainless body to deliver:
• 0.15 mm ultra-thin-die handling without warpage
• 0.01 mm placement repeatability for 0201–0402 micro-components
• 800 k+ pick-and-place cycles verified on Foxconn & BYD production lines
A patented vacuum-flow geometry eliminates component skew, reduces reject rates to <0.1 %, and cuts nozzle-change downtime to near zero. Swap in the XP400LP C# and turn your Mirae machine into a zero-defect, zero-wear, zero-interruption production cell.