Les buses SMT de la série AF de SONY sont conçues pour le placement de composants à grande vitesse et haute précision dans les processus de technologie de montage en surface (SMT). Conçues pour être compatibles avec les machines pick-and-place SONY TCM, TIM et E2000, ces buses excellent dans la manipulation de composants allant des résistances miniatures 0402 aux grands boîtiers BGA. Avec des pointes en alliage de tungstène et en céramique, ils garantissent une durabilité prolongée et des coûts de maintenance réduits dans des environnements de production exigeants.

The SONY SMT nozzles are core consumables specifically designed for high-precision chip mounters and are widely used in the field of electronics manufacturing. Their models cover the AF series and the CF series, and they are compatible with many mainstream chip mounters such as SONY TCM, TIM, and E2000. With the core advantages of wear resistance, high precision, and long service life, they can meet the diverse mounting requirements from tiny components (such as 0402) to large devices (such as BGA)

Hitachi nozzles are key components in the SMT process, used to accurately pick up and place electronic components. Different types of nozzles are suitable for components of different sizes and types, ensuring the accuracy and efficiency of the SMT process

The Hitachi nozzle is a key component in the chip - mounting process, used for accurately picking up and placing electronic components. Nozzles of different models are suitable for components of different sizes and types, ensuring the accuracy and efficiency of the chip - mounting process

The Hitachi nozzle is a crucial component in the chip - mounting process, used for precisely picking up and placing electronic components. Nozzles of different models are suitable for components of different sizes and types, ensuring the accuracy and efficiency of the chip - mounting process

‌Hitachi nozzles are key components in the SMT process, used to accurately pick up and place electronic components. Different types of nozzles are suitable for components of different sizes and types, ensuring the accuracy and efficiency of the SMT process‌‌

Hitachi nozzles are key components in the SMT process, used to accurately pick up and place electronic components. Different types of nozzles are suitable for components of different sizes and types, ensuring the accuracy and efficiency of the SMT process

The high-hardness ceramic nozzles, specifically designed for Hitachi GXH/G5S high-speed chip mounters, are made of alumina ceramic material. With outstanding wear resistance, precise pick-and-place performance, and broad compatibility as their core advantages, they are suitable for precision semiconductor packaging scenarios ranging from 0201 micro components to QFN/BGA and other components. This series covers mainstream models such as HV31, HV51, HV81, HA04, etc., and perfectly matches the original factory equipment. It offers a lifespan three times that of steel nozzles, significantly reducing downtime maintenance costs

Premium Ceramic Nozzles for Precision SMT Assembly
Designed for Hitachi GXH and G5S series pick-and-place machines, these high-performance ceramic nozzles ensure exceptional durability, precision, and compatibility in high-speed surface-mount technology (SMT) production. Ideal for handling delicate components like ICs, resistors, and capacitors, they are engineered to meet rigorous industrial standards

It is mainly applied to the Surface Mount Technology (SMT) production line in the electronics manufacturing industry, and is used to accurately pick up and mount electronic components onto Printed Circuit Boards (PCBs)

Les buses universelles GSM Flexjet sont des composants de précision conçus pour les machines de prélèvement et de placement SMT (Surface Mount Technology) à grande vitesse, spécifiquement optimisées pour la série GSM Flexjet d&39;Universal Instruments. Ces buses garantissent une précision, une durabilité et une compatibilité exceptionnelles sur une large gamme de composants électroniques, des résistances à puce ultra-petites (par exemple, 0201/0402) aux grandes pièces de forme irrégulière (par exemple, connecteurs, LED). Grâce à des matériaux avancés comme la céramique, des alliages durcis et des revêtements antistatiques, ils minimisent les taux de mauvais placement et maximisent l&39;efficacité de la production dans des environnements de fabrication exigeants.

The HSC/FZ30 series nozzles and components are specifically designed for SMT pick-and-place machines (such as the Universal GSM FJ3 series), offering a range of high-precision nozzle tips and compatible accessories in multiple models and specifications. These products cater to the mounting requirements of electronic components with different package types. Featuring high compatibility, wear and high-temperature resistance, and a quick-release design, the series significantly enhances the production efficiency and stability of pick-and-place machines, making them an ideal choice for equipment maintenance and upgrading in the electronics manufacturing industry