SONY AF Series SMT nozzles are engineered for high-speed, high-precision component placement in surface mount technology (SMT) processes. Designed for compatibility with SONY TCM, TIM, and E2000 pick-and-place machines, these nozzles excel in handling components ranging from miniature 0402 resistors to large BGA packages. With tungsten alloy and ceramic tips, they ensure extended durability and reduced maintenance costs in demanding production environments

The SONY SMT nozzles are core consumables specifically designed for high-precision chip mounters and are widely used in the field of electronics manufacturing. Their models cover the AF series and the CF series, and they are compatible with many mainstream chip mounters such as SONY TCM, TIM, and E2000. With the core advantages of wear resistance, high precision, and long service life, they can meet the diverse mounting requirements from tiny components (such as 0402) to large devices (such as BGA)

Hitachi nozzles are key components in the SMT process, used to accurately pick up and place electronic components. Different types of nozzles are suitable for components of different sizes and types, ensuring the accuracy and efficiency of the SMT process

The Hitachi nozzle is a key component in the chip - mounting process, used for accurately picking up and placing electronic components. Nozzles of different models are suitable for components of different sizes and types, ensuring the accuracy and efficiency of the chip - mounting process

The Hitachi nozzle is a crucial component in the chip - mounting process, used for precisely picking up and placing electronic components. Nozzles of different models are suitable for components of different sizes and types, ensuring the accuracy and efficiency of the chip - mounting process

‌Hitachi nozzles are key components in the SMT process, used to accurately pick up and place electronic components. Different types of nozzles are suitable for components of different sizes and types, ensuring the accuracy and efficiency of the SMT process‌‌

Hitachi nozzles are key components in the SMT process, used to accurately pick up and place electronic components. Different types of nozzles are suitable for components of different sizes and types, ensuring the accuracy and efficiency of the SMT process

The high-hardness ceramic nozzles, specifically designed for Hitachi GXH/G5S high-speed chip mounters, are made of alumina ceramic material. With outstanding wear resistance, precise pick-and-place performance, and broad compatibility as their core advantages, they are suitable for precision semiconductor packaging scenarios ranging from 0201 micro components to QFN/BGA and other components. This series covers mainstream models such as HV31, HV51, HV81, HA04, etc., and perfectly matches the original factory equipment. It offers a lifespan three times that of steel nozzles, significantly reducing downtime maintenance costs

Premium Ceramic Nozzles for Precision SMT Assembly
Designed for Hitachi GXH and G5S series pick-and-place machines, these high-performance ceramic nozzles ensure exceptional durability, precision, and compatibility in high-speed surface-mount technology (SMT) production. Ideal for handling delicate components like ICs, resistors, and capacitors, they are engineered to meet rigorous industrial standards

It is mainly applied to the Surface Mount Technology (SMT) production line in the electronics manufacturing industry, and is used to accurately pick up and mount electronic components onto Printed Circuit Boards (PCBs)

Uniwersalne dysze GSM Flexjet to precyzyjnie zaprojektowane komponenty przeznaczone do szybkich maszyn typu pick-and-place SMT (Surface Mount Technology), zoptymalizowane specjalnie do serii GSM Flexjet firmy Universal Instruments. Dysze te zapewniają wyjątkową dokładność, trwałość i kompatybilność z szeroką gamą podzespołów elektronicznych — od ultramałych rezystorów chipowych (np. 0201/0402) po duże części o nieregularnym kształcie (np. złącza, diody LED). Dzięki zaawansowanym materiałom, takim jak ceramika, utwardzone stopy i powłoki antystatyczne, minimalizują one liczbę błędów i maksymalizują wydajność produkcji w wymagających środowiskach produkcyjnych

Dysze i komponenty serii HSC/FZ30 zaprojektowano specjalnie do maszyn typu pick-and-place SMT (takich jak seria Universal GSM FJ3), oferując szereg precyzyjnych końcówek dysz i kompatybilnych akcesoriów w wielu modelach i specyfikacjach. Produkty te są dostosowane do wymagań montażowych podzespołów elektronicznych umieszczonych w różnych typach obudów. Seria ta charakteryzuje się wysoką kompatybilnością, odpornością na zużycie i wysoką temperaturę oraz konstrukcją umożliwiającą szybkie zwalnianie, co znacznie zwiększa wydajność produkcji i stabilność maszyn typu pick-and-place, dzięki czemu jest idealnym wyborem do konserwacji i modernizacji sprzętu w branży produkcji elektroniki.