SONY AF Series SMT nozzles are engineered for high-speed, high-precision component placement in surface mount technology (SMT) processes. Designed for compatibility with SONY TCM, TIM, and E2000 pick-and-place machines, these nozzles excel in handling components ranging from miniature 0402 resistors to large BGA packages. With tungsten alloy and ceramic tips, they ensure extended durability and reduced maintenance costs in demanding production environments

Las boquillas SMT de SONY son consumibles básicos diseñados específicamente para montadores de chips de alta precisión y se utilizan ampliamente en el campo de la fabricación de productos electrónicos. Sus modelos cubren las series AF y CF, y son compatibles con muchos montadores de chips convencionales como SONY TCM, TIM y E2000. Con las principales ventajas de resistencia al desgaste, alta precisión y larga vida útil, pueden satisfacer los diversos requisitos de montaje desde componentes pequeños (como 0402) hasta dispositivos grandes (como BGA).

Hitachi nozzles are key components in the SMT process, used to accurately pick up and place electronic components. Different types of nozzles are suitable for components of different sizes and types, ensuring the accuracy and efficiency of the SMT process

The Hitachi nozzle is a key component in the chip - mounting process, used for accurately picking up and placing electronic components. Nozzles of different models are suitable for components of different sizes and types, ensuring the accuracy and efficiency of the chip - mounting process

The Hitachi nozzle is a crucial component in the chip - mounting process, used for precisely picking up and placing electronic components. Nozzles of different models are suitable for components of different sizes and types, ensuring the accuracy and efficiency of the chip - mounting process

‌Hitachi nozzles are key components in the SMT process, used to accurately pick up and place electronic components. Different types of nozzles are suitable for components of different sizes and types, ensuring the accuracy and efficiency of the SMT process‌‌

Hitachi nozzles are key components in the SMT process, used to accurately pick up and place electronic components. Different types of nozzles are suitable for components of different sizes and types, ensuring the accuracy and efficiency of the SMT process

The high-hardness ceramic nozzles, specifically designed for Hitachi GXH/G5S high-speed chip mounters, are made of alumina ceramic material. With outstanding wear resistance, precise pick-and-place performance, and broad compatibility as their core advantages, they are suitable for precision semiconductor packaging scenarios ranging from 0201 micro components to QFN/BGA and other components. This series covers mainstream models such as HV31, HV51, HV81, HA04, etc., and perfectly matches the original factory equipment. It offers a lifespan three times that of steel nozzles, significantly reducing downtime maintenance costs

Premium Ceramic Nozzles for Precision SMT Assembly
Designed for Hitachi GXH and G5S series pick-and-place machines, these high-performance ceramic nozzles ensure exceptional durability, precision, and compatibility in high-speed surface-mount technology (SMT) production. Ideal for handling delicate components like ICs, resistors, and capacitors, they are engineered to meet rigorous industrial standards

It is mainly applied to the Surface Mount Technology (SMT) production line in the electronics manufacturing industry, and is used to accurately pick up and mount electronic components onto Printed Circuit Boards (PCBs)

The Universal GSM Flexjet Nozzles are precision-engineered components designed for high-speed SMT (Surface Mount Technology) pick-and-place machines, specifically optimized for Universal Instruments' GSM Flexjet series. These nozzles ensure exceptional accuracy, durability, and compatibility across a wide range of electronic components—from ultra-small chip resistors (e.g., 0201/0402) to large, irregularly shaped parts (e.g., connectors, LEDs). With advanced materials like ceramic, hardened alloys, and anti-static coatings, they minimize misplacement rates and maximize production efficiency in demanding manufacturing environments

Las boquillas y componentes de la serie HSC/FZ30 están diseñados específicamente para máquinas de selección y colocación SMT (como la serie Universal GSM FJ3) y ​​ofrecen una gama de puntas de boquilla de alta precisión y accesorios compatibles en múltiples modelos y especificaciones. Estos productos satisfacen los requisitos de montaje de componentes electrónicos con diferentes tipos de paquetes. Con alta compatibilidad, resistencia al desgaste y a las altas temperaturas, y un diseño de liberación rápida, la serie mejora significativamente la eficiencia de producción y la estabilidad de las máquinas de selección y colocación, lo que las convierte en una opción ideal para el mantenimiento y la actualización de equipos en la industria de fabricación de productos electrónicos.