Full Automatic Solder Paste Printer | High-Precision SMT Equipment for PCB Assembly | Boost Efficiency 35%
This solder paste printer integrates a 12MP high-res camera, linear motor drives, and multi-axis motion control, achieving 15s/cycle speed and ±5μm repeatability. Key features: 1) Dual-side vision alignment compensating PCB/stencil warpage; 2) Smart squeegee pressure (50-500N adjustable) for diverse pastes; 3) Climate-controlled chamber ensuring process stability. MES connectivity enables real-time SPC analysis and defect tracking. Enhanced mechanics and algorithms boost uptime to 98% while cutting energy use by 40% versus conventional models. IPC-7525-compliant, it excels in precision applications (smartphone boards, IoT modules, industrial controls), accelerating NPI cycles and maximizing yield-to-throughput ratios in advanced electronics manufacturing.
5.0
design customization
Please fill out the form below to request a quote or to request more information about us. Please be sure to upload customized requirement documents or pictures, and we will get back to you as soon as possible with a response. we're ready to start working on your new project, contact us now to get started.
Please fill out the form below to request a quote or to request more information about us. please be as detailed as possible in your message, and we will get back to you as soon as possible with a response. we're ready to start working on your new project, contact us now to get started.
Product Introduction
Achieve precision solder paste deposition with our high-speed, fully automated printing solution. Designed for SMT production lines, this system delivers consistent, repeatable results for PCB assembly.
Product Display
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Product Advantages
Advanced Vision Alignment: High-resolution cameras ensure accurate positioning (<±0.02mm) for fine-pitch components (0201/01005)
Programmable Printing Parameters: Adjust pressure, speed, and stroke for optimal paste transfer.
Programmable Printing Parameters: Adjust pressure, speed, and stroke for optimal paste transfer.
Quick Changeover: Tool-less stencil clamping and automated height adjustment reduce downtime.
Technical Specifications
| Item | Parameter |
|---|---|
| PCB print size | L400mmxW300mm |
| Steel mesh size | L600mmxW550mm |
| PCB thickness | 0.4-5mm |
| Send rouge and convey height | 900士40mm |
| Printing accuracy | 士0.1mm |
| Power Supply Requirement | 220V,50/60Hz,500W |
Application Scenario
Consumer electronics
Smartphone motherboards, TWS earphone circuit boards, smartwatch modules
Automotive electronics
ECU control board, vehicle-mounted sensors, charging modules for new energy vehicles
LED display
Mini LED backlight module, outdoor display screen unit
Medical electronics
PCBs for medical imaging equipment, implantable sensors
FAQ
1
How to solve the problem of printing offset / misalignment?
Check the fixation of the stencil and the PCB，Clean the vision system，Recalibrate the origin
2
What should be done if the solder paste thickness is uneven?
Adjust the squeegee pressure，Check the stencil opening，Clean the bottom of the stencil，
3
How to deal with the frequent alarms of the printing press?
View the alarm code，Check the sensor，Restart the device
4
How to extend the service life of the stencil?
Regular cleaning，Proper storage，Control the angle of the squeegee
5
How to balance the printing speed and quality
Low-speed test，optimize parameters，maintenance routine
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Contact person: jiaqin luo
Tel / WhatsApp: +86 135 383 96713
E-mail: aismtsupplier@gail.com
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