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Yamaha YG100 High-Speed Fully Automated SMT Placement Machine | Top Performance for PCB Assembly 1
Yamaha YG100 High-Speed Fully Automated SMT Placement Machine | Top Performance for PCB Assembly 2
Yamaha YG100 High-Speed Fully Automated SMT Placement Machine | Top Performance for PCB Assembly 3
Yamaha YG100 High-Speed Fully Automated SMT Placement Machine | Top Performance for PCB Assembly 4
Yamaha YG100 High-Speed Fully Automated SMT Placement Machine | Top Performance for PCB Assembly 5
Yamaha YG100 High-Speed Fully Automated SMT Placement Machine | Top Performance for PCB Assembly 1
Yamaha YG100 High-Speed Fully Automated SMT Placement Machine | Top Performance for PCB Assembly 2
Yamaha YG100 High-Speed Fully Automated SMT Placement Machine | Top Performance for PCB Assembly 3
Yamaha YG100 High-Speed Fully Automated SMT Placement Machine | Top Performance for PCB Assembly 4
Yamaha YG100 High-Speed Fully Automated SMT Placement Machine | Top Performance for PCB Assembly 5

Yamaha YG100 High-Speed Fully Automated SMT Placement Machine | Top Performance for PCB Assembly

The Yamaha YG100 High-Speed Fully Automated SMT Placement Machine offers top performance for PCB assembly with high-speed and accuracy. This advanced machine streamlines the production process, ensuring efficiency and quality in circuit board manufacturing.

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    Product Introduction 

    The YG100 is a high-speed, high-precision Surface Mount Technology (SMT) placement machine launched by Yamaha, specifically designed for the electronics manufacturing industry. It is suitable for the placement of small and medium-sized electronic components and is widely used in consumer electronics, automotive electronics, industrial control, and other fields due to its efficient, flexible, and stable performance.


    YG100 (1)
    YG100 (1)

    Product Parameters

    I. Equipment Parameters of YAMAHA SMT Placement Machine - YG100 Type:

    Substrate Dimensions:

    M - Type: L460 x W330~L50 x W50mm / t = 0.4~3.0mm

    L - Type: L460 x W440~L50 x W50mm / t = 0.4~3.0mm

    ※sATS Usage: L460 x W440~L50 x W50mm

    Placement Speed: Chip: 0.15 seconds per component / 32mm QFP Standard: 1.70 seconds per component

    IPC 9850 Conditions: 17700 CPH, Chip: 0.20 seconds per component

    Placement Accuracy: (Absolute Accuracy) Chip: ±0.05mm (3σ) / QFP: ±0.05mm (3σ)

    Placement Angle: (in units of 0.01±180°)

    Supported Components: 0402~SOP, SOJ, 84-pin PLCC, 0.5mm pitch QFP BGA, CSP□31mm, 100-millimeter connector, IC socket.

    Height of Installed Components: 15mm

    Component Recognition Method: Multi-angle illumination digital multi-camera system (34?/pixel), multi-angle illumination good vision system (79?/pixel).

    Power Supply: 3-phase AC 416~200 V, V±10 %, 50 / 60Hz, 4.8kVA

    Air Supply Source: 5.5㎏/? (Dry Air) / 140?/min

    Dimensions and Weight: 1,650(W) x 1,562(W) x 1,850(H)mm

    Weight: 1,630㎏

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